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RFD10P03LSM Arkusz danych(PDF) 10 Page - Harris Corporation |
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RFD10P03LSM Arkusz danych(HTML) 10 Page - Harris Corporation |
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10 / 12 page ![]() 10 RFD10P03L, RFD10P03LSM, RFP10P03L TO-251AA 3 LEAD JEDEC TO-251AA PLASTIC PACKAGE LEAD NO. 1 - GATE LEAD NO. 2 - DRAIN LEAD NO. 3 - SOURCE TERM. 4 - DRAIN b2 E A c SEATING L1 D L b e 12 3 b1 H1 J1 A1 e1 TERM. 4 PLANE SYMBOL INCHES MILLIMETERS NOTES MIN MAX MIN MAX A 0.086 0.094 2.19 2.38 - A1 0.018 0.022 0.46 0.55 3, 4 b 0.028 0.032 0.72 0.81 3, 4 b1 0.033 0.040 0.84 1.01 3 b2 0.205 0.215 5.21 5.46 3, 4 c 0.018 0.022 0.46 0.55 3, 4 D 0.270 0.290 6.86 7.36 - E 0.250 0.265 6.35 6.73 - e 0.090 TYP 2.28 TYP 5 e1 0.180 BSC 4.57 BSC 5 H1 0.035 0.045 0.89 1.14 - J1 0.040 0.045 1.02 1.14 6 L 0.355 0.375 9.02 9.52 - L1 0.075 0.090 1.91 2.28 2 NOTES: 1. These dimensions are within allowable dimensions of Rev. C of JEDEC TO-251AA outline dated 9-88. 2. Solder finish uncontrolled in this area. 3. Dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder plating. 5. Position of lead to be measured 0.250 inches (6.35mm) from bot- tom of dimension D. 6. Position of lead to be measured 0.100 inches (2.54mm) from bot- tom of dimension D. 7. Controlling dimension: Inch. 8. Revision 2 dated 10-95. |
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