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PESD1663U005 Arkusz danych(PDF) 5 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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PESD1663U005 Arkusz danych(HTML) 5 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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5 / 7 page ![]() 0603-2 Package 13 Package Dimension Recommended Solder Pad Footprint *Sizes in mm Notes: H This solder pad layout is for reference purposes only. Unit: Millimeters Dimension Min. Typ. Max. L 1.45 1.60 1.75 W 0.70 0.83 0.95 P 0.20 0.35 0.50 H 0.26 0.36 0.46 PESD1663U005 Rev : www.leiditech.com 01.06.2015 5/7 |
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