CS9201 datasheet(2/8 Pages) ONSEMI

2 / 8 page

CS9201

http://onsemi.com

MAXIMUM RATINGS*

Parameter

Value

Unit

Power Dissipation

Internally Limited

–

Input Voltage (VIN):

Peak Transient Voltage (60 V Load Dump @ VIN = 14 V)

–15 to 36

Output Current

Internally Limited

–

ESD Susceptibility (Human Body Model)

4.0

Package Thermal Resistance:

Junction–to–Case, RθJC

Junction–to–Ambient, RθJA

110

°C/W

Junction Temperature

–40 to +150

°C

Storage Temperature

–55 to +150

°C

Lead Temperature Soldering:

Reflow (SMD styles only) Note 1

230 Peak

°C

1. 60 second maximum above 183

°C.

*The maximum package power dissipation must be observed.

ELECTRICAL CHARACTERISTICS (6.0 V

≤ VIN ≤ 26 V, IOUT = 1.0 mA, –40°C ≤ TJ ≤ 125°C; unless otherwise stated.)

Parameter

Test Conditions

Min

Typ

Max

Unit

Output Stage

Output Voltage, VOUT

9.0 V < VIN < 16 V, 100 uA ≤ IOUT ≤ 100 mA

6.0 V < VIN < 26 V, 100 uA ≤ IOUT ≤ 100 mA

4.90

4.85

5.00

5.10

5.15

Dropout Voltage (VIN–VOUT)

IOUT = 100 mA

IOUT = 100 µA

–

400

100

600

150

Load Regulation

VIN = 14 V, 100 µA ≤ IOUT ≤ 100 mA

–

Line Regulation

6.0 V < V < 26 V, IOUT = 1.0 mA

–

Quiescent Current, (IQ)

IOUT = 100 µA, VIN = 12 V

IOUT ≤ 50 mA

IOUT ≤ 100 mA

–

450

750

µA

Ripple Rejection

7.0 V

≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz

–

Current Limit

–

105

200

–

Short Circuit Output Current

VOUT = 0 V

125

–

Thermal Shutdown (Note 2)

–

150

180

–

°C

Overvoltage Shutdown

VOUT ≤ 1.0 V

2. This parameter is guaranteed by design, but not parametrically tested in production.

PACKAGE LEAD DESCRIPTION

Package Lead Number

SO–8

Lead Symbol

Function

VOUT

5.0 V,

± 2%, 100 mA output.

4, 5

No connection.

2, 3, 6, 7

GND

Ground.

VIN

Input voltage.

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