MAXM17536 datasheet(20/22 Pages) MAXIM

20 / 22 page

PCB Layout Guidelines

● All connections carrying pulsed currents must be

very short and as wide as possible. The inductance

of these connections must be kept to an absolute

minimum due to the high di/dt of the currents. Since

inductance of a current carrying loop is proportional to

the area enclosed by the loop, if the loop area is made

very small, inductance is reduced. Additionally, small

current-loop areas reduce radiated EMI.

● A ceramic input-filter capacitor should be placed close

to the IN pins of the module. This eliminates as much

trace-inductance effects as possible and gives the

module a cleaner voltage supply.

● PCB layout also affects the thermal performance of

the design. A number of thermal vias that connect to

a large ground plane should be provided under the

exposed pad of the part, for efficient heat dissipation.

● For a sample layout that ensures first pass success,

refer to the MAXM17536 evaluation kit PCB layout

available at

www.maximintegrated.com.

OUT

PGND

VCC

EN/UVLO

7V to 60V

SGND

5V, 4A

VOUT

MAXM17536

MODE/SYNC

EXTVCC

BST

2.2pF

47µF 47µF 47µF

VIN

4.7µF 4.7µF

715kΩ

CSS

22nF

RESET

38.3kΩ

174kΩ

C1,C2,C3,C4: GRM31CZ72A475KE11L

C5,C6,C7: GRM32ER71A476KE15L

Typical Application Circuits

Typical Application Circuit for 5V Output

www.maximintegrated.com

Maxim Integrated │ 20

MAXM17536

4.5V to 60V, 4A High-Efficiency, DC-DC Step-Down

SiP Power Module with Integrated Inductor

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