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FUSB308B Arkusz danych(PDF) 3 Page - ON Semiconductor |
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FUSB308B Arkusz danych(HTML) 3 Page - ON Semiconductor |
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3 / 53 page ![]() FUSB308B www.onsemi.com 3 Table 1. ORDERING INFORMATION Part Number Top Marking Operating Temperature Range Package Packing Method† FUSB308BVMPX FUSB 308BV Automotive −40 to 105°C 16–Lead Molded Leadless Package (QFN) JEDEC, ML220, 3 mm Square Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Typical Application Figure 1. FUSB308B Typical Typical Desktop Computing Application Alternate Mode DP Mux + SBU PSU FPF2595C CC2 CC1 INT_N SDA SCL Type−C receptacle FUSB308B GND VCONN VDD VBUS TCPM USB 2.0& 3.1 Gen1 PHY SRC_HV VIN VOUT ON VOUT VIN SRC I2C_ADDR_SEL/ ORIENT 220pF 220pF 25V ISET GPO1 GPO2 ON ISET V5 V12 MUX_SEL0 MUX_SEL1 GPU POL SEL1 SEL2 FPF2595C 1 mF 25V 10 mF 10 mF 10 mF |
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