Output Specifications (@ 25° C, unless otherwise specified)

Heatsink Recommendations

• We recommend that solid state relay modules be mounted to a

heatsink sufficient to maintain the module’s base temperature at

less than 85°C under worst case ambient temperature and load

conditions.

• The heatsink mounting surface should be a smooth (30-40 micro-inch

finish), flat (30-40 micro-inch flatness across mating area), un-painted

surface which is clean and free of oxidation.

• An even coating of thermal compound (Dow Corning DC340 or

equivalent) should be applied to both the heatsink and module

Operating Diagrams

• The module should be mounted to the heatsink using two #8 screws.

Parameter

Units

12A Models

25A Models

40A Models

VDC

200

200

200

A

12

25

40

Single Cycle Surge Current

A

120

120

200

Leakage Current (Off-State) @Rated Current

mA

12

12

12

On-State Voltage Drop @Rated Current

VDC

2.83

2.83

2.83

Turn-On Time (Max.)

µs

600

600

600

Turn-Off Time (Max.)

µs

2600

2600

2600

Thermal Resistance, Junction to Case

0.7

0.7

0.5

* See Derating curve

* Overall height dimensions includes with clear cover

Dimensions in mm

Outline Dimensions

Electrical Characteristics (Thermal Derating Curves)

Solid State Relay

02-2018, Rev. 0218

www.te.com

© 2015 Tyco Electronics Corporation,

a TE Connectivity Ltd. company

Datasheets and product specification

according to IEC 61810-1 and to be

used only together with the ‘Definitions’

section.

Datasheets and product data is subject to

the terms of the disclaimer and all chap-

ters of the ‘Definitions’ section, available

at http://relays.te.com/definitions

Datasheets, product data, ‘Definitions’

section, application notes and all specifi-

cations are subject to change.

2

Potter & Brumfield