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LM317S/NOPB Arkusz danych(PDF) 31 Page - Texas Instruments |
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LM317S/NOPB Arkusz danych(HTML) 31 Page - Texas Instruments |
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31 / 51 page ![]() 31 LM117, LM317-N www.ti.com SNVS774Q – MAY 2004 – REVISED JUNE 2020 Product Folder Links: LM117 LM317-N Submit Documentation Feedback Copyright © 2004–2020, Texas Instruments Incorporated Layout Guidelines (continued) (1) Tab of device attached to topside of copper. Table 1. RθJA Different Heatsink Area LAYOUT COPPER AREA THERMAL RESISTANCE Top Side (in2)(1) Bottom Side (in2) (RθJA°C/W) TO-252 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1.0 0 47 7 0.066 0.2 84 8 0.066 0.4 70 9 0.066 0.6 63 10 0.066 0.8 57 11 0.066 1.0 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 Figure 41. RθJA vs 2-oz. Copper Area for TO-252 Figure 42. Maximum Allowable Power Dissipation vs Ambient Temperature for TO-252 |
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