Variable Capacitor LXRW0YV201-059

p16/18

16

September,2018

method of the NC terminals and the PCB material and thickness.

Therefore, be sure to verify the

characteristics in the actual set.

When using non-standard lands, contact Murata beforehand.

5. Notice for Chip Placer:

When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-

out chucking locating claw or a suction nozzle.

To prevent products from damages, be sure to follow the

specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB,

be aware that mechanical chucking may damage products.

6. Soldering Conditions:

Carefully perform preheating so that the temperature difference (

T) between the solder and products surface

should be in the following range.

When products are immersed in solvent after mounting, pay special

attention to maintain the temperature difference within 100 °C.

Soldering must be carried out by the above

mentioned conditions to prevent products from damage.

Contact Murata before use if concerning other

soldering conditions.

Atmosphere: N2

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less

7.

Cleaning Conditions:

Any cleaning is not permitted.

60-120 sec



Temperature (°C)

Pre-heating

Time (s.)

217 °C

60-150 sec.

Cooling down

slowly

260 °C

Within 30 sec

MAX260 °C

150 °C

200 °C

Reflow soldering standard conditions(Example)