Data Sheet

HMC773ALC3B

Rev. F | Page 5 of 22

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1

2

3

GND

LO

GND

GND

RF

GND

9

8

7

45

6

12

11

10

HMC773ALC3B

TOP VIEW

(Not to Scale)

NOTES

1. NIC = NOT INTERNALLY CONNECTED. THESE PINS

ARE NOT CONNECTED INTERNALLY. HOWEVER, ALL

DATA SHOWN HEREIN WAS MEASURED WITH THESE

PINS CONNECTED TO RF/DC GROUND EXTERNALLY.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO RF/DC GROUND.

PACKAGE

BASE

Figure 2. Pin Configuration

Table 5. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 7, 9, 10, 12

GND

Ground. Connect these pins and package bottom to RF/dc ground. See Figure 3 for the GND interface

schematic.

2

LO

Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the LO interface

schematic.

4, 6, 11

NIC

Not Internally Connected. These pins are not connected internally. However, all data shown herein was

measured with these pins connected to RF/dc ground externally.

5

IF

Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc,

block this pin externally using a series capacitor with a value that passes the necessary IF frequency

range. For operation to dc, to prevent device malfunction or failure, this pin must not source or sink

more than 2 mA of current. See Figure 5 for the IF interface schematic.

8

RF

Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the RF interface

schematic.

EP

Exposed Pad. The exposed pad must be connected to RF/dc ground.

INTERFACE SCHEMATICS

GND

Figure 3. GND Interface

LO

Figure 4. LO Interface

IF

Figure 5. IF Interface

RF

Figure 6. RF Interface