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USB82642 Arkusz danych(PDF) 54 Page - Microchip Technology |
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USB82642 Arkusz danych(HTML) 54 Page - Microchip Technology |
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54 / 64 page ![]() USB82642 DS60001253F-page 54 2012-2021 Microchip Technology Inc. APPENDIX A: DATA SHEET REVISION HISTORY TABLE A-1: CUSTOMER REVISION HISTORY Revision Level & Date Section/Figure/Entry Correction DS60001253F (04-26-21) Section 8.3, Package Ther- mal Specifications Added package thermal information. DS60001253E (10-24-18) Section 6.1, "Pin Reset States" • TABLE 6-2:: Pin SPI_DO/SDA_EP/SPI_SPD_- SEL: corrected Section 7.5.6, “In-Circuit EEPROM Programming” • Removed DS60001253D (06-11-18) Section 8.1, Maximum Guar- anteed Ratings • HBM ESD Performance inserted. DS60001253C (02-08-17) Product Identification Sys- tem Adopted according to new system. Chapter 3.0, Pin Configuration Package marking information (legend) moved to Chapter 10.0, Package Information Chapter 10.0, Package Information New section Section 10.1, "Package Marking Information" DS60001253B (06-29-15) All Trademark and last page updated. • GPIO1 -> GPO1 (there is no input functional- ity) • Package drawing exchanged, QFN -> VQFN Cover Sheet Key benefit added: • Supports storage addressability of up to 2 TB Changed: • Configures internal code using an external I2C ROM or SPI ROM -> Configures internal code using an external SPI ROM Chapter 1.0 Flash media added: Embedded MultiMediaCard (eMMC) Section 1.1, Device Fea- tures Changed: • Optional support for external firmware access via SPI and I2C interfaces -> Optional support for external firmware access via SPI interfaces Section 1.2.2 “Software Fea- tures”, Section 1.1.2 “Con- figurable Hub Features” Both sections merged. Chapter 2.0 Figure 2-1: Interface: SD/SDIO Socket -> SD/MMC Socket, eMMM IC Chapter 3.0 Figure 3-1 adapted (GPIO1 -> GPO1) Chapter 4.0 Table A-1 adapted (GPIO1 -> GPO1) |
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