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ICS680-01 Arkusz danych(PDF) 3 Page - Integrated Circuit Systems |
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ICS680-01 Arkusz danych(HTML) 3 Page - Integrated Circuit Systems |
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3 / 8 page ![]() Networking Clock Synthesizer and Zero Delay Buffer MDS 680-01 F 3 Revision 020305 Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com ICS680-01 External Components The ICS680-01 requires a minimum number of external components for proper operation. Decoupling Capacitor A decoupling capacitor of 0.01µF must be connected between VDD (pins 5 and 16) and GND (pins 6 and 15), as close to these pins as possible. For optimum device performance, the decoupling capacitor should be mounted on the component side of the PCB. Avoid the use of vias in the decoupling circuit. Series Termination Resistor When the PCB trace between the clock outputs and the loads are over 1 inch, series termination should be used. To series terminate a 50 Ω trace (a commonly used trace impedance) place a 33 Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20 Ω. Crystal Information The crystal used should be a fundamental mode (do not use third overtone), parallel resonant. Crystal capacitors should be connected from pins X1 to ground and X2 to ground to optimize the initial accuracy. The value of these capacitors is given by the following equation crystal caps (pF) = (CL-6)x2 In the equation, CL is the crystal load capacitance. So for a crystal with a 16 pF load capacitance, two 20 pF[(16-6)x2] capacitors should be used PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1) The 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) The external crystal should be mounted just next to the device with short traces. The X1 and X2 traces should not be routed next to each other with minimum spaces, instead they should be separated and away from other traces. 3) To minimize EMI, the 33 Ω series termination resistor (if needed) should be placed close to the clock output. 4) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers. Other signal traces should be routed away from the ICS680-01. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. 18 VDD Power Connect to voltage supply. 19 ICLK Input Zero Delay Buffer Input. Weak Internal pull-up. 20 25M Output 25 MHz reference output clock. Weak internal pull-down when tri-state. 21 S1 Input Select pin 1. See table above. 22 PDTS Power Power-down tri-state. Powers down entire chip and tri-states outputs when low. Internal pull-up resistor. 23 VDD Power Connect to voltage supply. 24 X2 XO Crystal output. Connect this pin to a crystal. Float for clock input. Pin Number Pin Name Pin Type Pin Description |
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