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2.0SMB Arkusz danych(PDF) 6 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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2.0SMB Arkusz danych(HTML) 6 Page - Shanghai Leiditech Electronic Technology Co., Ltd |
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6 / 6 page ![]() Solder Reflow Recommendations ● Recommendedreflowmethods:IR,vapor phaseoven,hotairoven,wavesolder. ● Thedevicecanbeexposedtoamaximum temperatureof265°Cfor10seconds. ● Devicescanbecleanedusingstandard industrymethodsandsolvents. Notes: If reflow temperaturesexceedthe recommended profile, devicesmay not meettheperformancerequirements. Summary of Packing Options Package Type Description Packing Quantity Industry Standard DO-214AA(SMB) EmbossedCarrierReelPack 3000PCS EIA-481-D SurfaceMount-2000W>2.0SMBseries Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : www.leiditech.com 01.06.2018 6/6 |
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