AVDD to AGND ....................................................-0.3V to +2.0V

DVDD to DGND....................................................-0.3V to +2.0V

AVDD to DVDD ....................................................-0.3V to +0.3V

OVDD to DGND ...................................................-0.3V to +3.6V

AGND to DGND ...................................................-0.3V to +0.3V

CSB, SCLK, SDI, FCLK to DGND .......................-0.3V to +3.6V

SDO, INTB, INT2B

to DGND........ -0.3V to the lower of (3.6V and OVDD + 0.3V)

All Other Pins

to AGND ......... -0.3V to the lower of (2.0V and AVDD + 0.3V)

Maximum Current into Any Pin.........................................±50mA

28-Pin TQFN

(derate 34.5mW/ºC above +70ºC)..........................2758.6mW

30-Bump WLP

(derate 24.3mW/ºC above +70ºC)..........................1945.5mW

Operating Temperature Range...............................0ºC to +70°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (Soldering, 10sec).............................+300°C

Soldering Temperature (reflow).......................................+260°C

TQFN

WLP

(Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

BIOIMPEDANCE (BIOZ) CHANNEL

Signal Generator Resolution

Square wave generator

1

Bits

DRVP/N Injected Full-Scale

Current

Programmable, see Register Map

8 to 96

DRVP/N Injected Current

Accuracy

Internal bias resistor

-30

+30

%

External bias resistor (0.1%, 10ppm, 324kΩ)

-10

+10

DRVP/N Injected Current

Power Supply Rejection

<±1

%/V

DRVP/N Injected Current

Temperatue Coefficient

(0.1%, 10ppm, 324kΩ)

50

ppm/°C

DRVP/N Compliance Voltage

0.5)

Current Injection Frequency

Programmable, see Register Map

0.125 to

131.072

kHz

AC Differential Input Range

Shift from nominal gain < 1% (1.1V)

25

mV

Shift from nominal gain < 1% (1.8V)

90

BioZ Channel Gain

Programmable, see Register Map

10 to 80

V/V

ADC Sample Rate

Programmable, see Register Map

24.98 to

64

sps

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

MAX30002

Ultra-Low-Power, Single-Channel Integrated

Bioimpedance (BioZ) AFE

www.maximintegrated.com

Maxim Integrated │ 3