RTI-21
4.0 OPERATING CONDITIONS
ABSOLUTE MAXIMUM RATINGS 1
(referenced to VSS)
Recommended Operating Conditions
BUS ARBITRATION
NAME
PIN NUMBER
TYPE
ACTIVE
DESCRIPTION
LCC
PGA
DMARQ
47
F11
TO
AH
Direct Memory Access Request. Active high
output requesting RTI access to memory.
MEMCK
48
D11
TI
AL
Memory Clock (DMA Grant). Active low input
signaling the RTI that a memory access is
granted. Internal to the RTI, receipt of MEMCK
generates RAM chip select and RAM read/write
signals.
EXT TST
29
L9
TDI
--
External Self-test Enable. Multi-function input
pin. In self-test mode forcing this pin high
allows the monitoring of self-test activity at the
bus stub. When the RTI is not in self-test this
pin defines the function of TALEN/PARITY.
EXT TST CH SEL
A/B
31
K9
TUI
--
External Self-test Channel Select. A/B Multi-
function input pin. In self-test mode forcing this
pin high selects the channel on which the self-
test is performed (Channel A = 1, Channel B =
0). When the RTI is not in self-test this pin
defines the function of TALEN/PARITY.
SYMBOL
PARAMETER
LIMITS
UNIT
VDD
DC supply voltage
-0.3 to +7.0
V
VIO
Voltage on any pin
-0.3 to VDD+0.3
V
II
DC input current
±10
mA
TSTG
Storage temperature
-65 to +150
°C
PD
Maximum power dissipation
300
mW
TJ
Maximum junction temperature
+175
°C
Θ
JC
Thermal resistance, junction-to-case
20
°C/W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not
recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
SYMBOL
PARAMETER
LIMITS
UNIT
VDD
DC supply voltage
4.5 to 5.5
V
VIN
DC input voltage
0 to VDD
V
TC
Temperature range
-55 to +125
°C
FO
Operating frequency
12
± .01%
MHz
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