MAX14724 datasheet(2/25 Pages) MAXIM

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V+ ............................................................................-0.3V to +6V

V- .............................................................................-6V to +0.3V

VL ............................................................................-0.3V to +6V

V+ to V- ...................................................................-0.3V to +6V

VL to V-....................................................................-0.3V to +9V

NO_, COM_ (Note 1) ..........................(V- - 0.3V) to (V+ + 0.3V)

SCL/SCK, SDA/DI, I2C/CS, ADD/DO .....................-0.3V to +6V

ADD/DO to V-..........................................................-0.3V to +9V

Continuous Current into NO_, COM_ ..............................±50mA

Peak Current into NO_, COM_

(pulsed at 1ms, 10% duty cycle) ................................±100mA

Continuous Power Dissipation

20 TQFN (derate 25.6mW/°C above +70°C).............2051mW

20 WLP(derate 21.7mW/°C above +70°C)................1736mW

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -40°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

Note 1: Signals on COM_ and NO_ exceeding V+ or V- are clamped by internal diodes.

(Note 2)

TQFN

Junction-to-Ambient Thermal Resistance (θJA) ..........39°C/W

Junction-to-Case Thermal Resistance (θJC).................6°C/W

WLP

Junction-to-Ambient Thermal Resistance (θJA) ..........46°C/W

(V+ = 1.6V to 5V, V- = (V+ - 5.5V) to 0V, VL = 0V to 5.5V (Notes 3, 4), TA = -40°C to +85°C, unless otherwise noted. Typical values are

at V+ = 2.5V, V- = -2.5V, VL = 2.5V, TA = +25°C.) (Note 5)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

V+ Supply

V+

1.6

5.5

V- Supply

V-

V+ - 5.5

VL Supply

V- > -2.5V

5.5

V- ≤ -2.5V

V- + 8

V+ Supply Current

I+

TA = +25°C

µA

VL Supply Current

IVL

TA = +25°C

1.5

µA

ANALOG SWITCH (Note 6)

Analog Signal Range

VCOM_,

VNO_

V-

V+

On-Resistance

RON

ICOM_ = 10mA, V+ = 2.5V,

V- = -2.5V, VNO_ = V- or V+

ICOM_ = 10mA, V+ = 3.0V,

V- = 0V, VNO_ = 1.5V

On-Resistance Match Between

Channels (Note 7)

ΔRON

ICOM_ = 10mA, V+ = 2.5V,

V- = -2.5V, VNO_ = V- or V+

0.5

1.25

ICOM_ = 10mA, V+ = 3.0V,

V- = 0V , VNO_ = 1.5V

1.35

MAX14724

Serial-Controlled 8:4 Matrix Switch Multiplexer

www.maximintegrated.com

Maxim Integrated │ 2

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

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