ADP2387ACPZN-R7 datasheet(6/25 Pages) AD

6 / 25 page

ADP2387

Data Sheet

Rev. C | Page 6 of 25

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN, SW, EN, PGOOD

−0.3 V to +22 V

SW 10 ns Transient

−2.5 V to +22 V

SW 100 ns Transient

−1 V to +22 V

BST

VSW + 6 V

FB, SS, COMP, ILIM, RT

−0.3 V to +6 V

VREG

−0.3 V to +12 V

PGND to GND

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Maximum Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE



is specified for the worst case conditions, that is, a device

soldered in the circuit board (4-layer, JEDEC standard board)

for surface mount packages.

Table 3. Thermal Resistance

Package Type



Unit

24-Lead LFCSP

42.6

6.8 (EP, SW)

°C/W

2.3 (EP, GND)

°C/W

ESD CAUTION

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