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AS5013 Arkusz danych(PDF) 42 Page - ams AG |
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AS5013 Arkusz danych(HTML) 42 Page - ams AG |
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42 / 50 page ![]() Page 42 ams Datasheet Document Feedback [v2-00] 2021-Apr-19 AS5013 − Pack age Drawings & Mark ings Mechanical Data Figure 43: Die Placement and Hall Array Position Note(s): 1. All dimensions in mm. 2. The Hall array center is located in the center of the IC package. Hall array radius is 1.1mm. 3. Die thickness is 150μm nominal. 4. Adhesive thickness 15μm nominal. 5. Leadframe thickness 76μm nominal. Recommended Footprint Figure 44: Footprint Recommended Footprint Data Symbol (mm) Typ C1 3.7 C2 3.7 E 0.65 X1 0.40 Y1 0.7 X2 2.6 Y2 2.6 Y1 X1 X2 E C1 1 |
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