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STA709 Arkusz danych(PDF) 5 Page - STMicroelectronics |
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STA709 Arkusz danych(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() Ref. Dimensions in mm Min. Typ. Max. b1 - 0.15 - D 9.00 BSC D1(2) 8.75 BSC D2 - 6.70 - e 0.50 BSC E 9.00 BSC E1(2) 8.75 BSC E2 - 6.70 - L 0.30 - 0.50 L1 0.15 REF L2 - 0.10 - P - - 0.60 Tolerance of form and position aaa 0.15 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 1. Maximum allowable burr is 0.076 mm in all directions. 2. D1 and E1 are Maximum plastic body size dimensions including mold mismatch. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is "0.25 mm (0.0098 inch)" per side. Note: The package is compliant to IPC/JEDEC J-STD-020D June 2007 standard Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, MSL Level 3. STA709 VFQFPN-64 (9x9x1.0mm) package information DB3139 - Rev 2 page 5/7 |
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