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MIC2033 Arkusz danych(PDF) 6 Page - Microchip Technology |
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MIC2033 Arkusz danych(HTML) 6 Page - Microchip Technology |
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6 / 28 page ![]() MIC2033 DS20005539C-page 6 2018 - 2022 Microchip Technology Inc. and its subsidiaries. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Operating Temperature Range TJ –40 — +125 °C Note 1 Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 10s Package Thermal Resistances Thermal Resistance SOT-23-6 JA — 177.2 — °C/W — Thermal Resistance 6-pin 2 mm x 2 mm DFN JA — 90 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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