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STM32L100RC Arkusz danych(PDF) 91 Page - STMicroelectronics

Numer części STM32L100RC
Szczegółowy opis  Ultra-low-power 32b MCU ARM®-based Cortex®-M3, 256KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC, memory I/F
PDF  106 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L100RC Arkusz danych(HTML) 91 Page - STMicroelectronics

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STM32L100RC
97
Figure 25. Maximum dynamic current consumption on VREF+ supply pin during ADC
conversion
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 7. The applicable
procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors
should be ceramic (good quality). They should be placed as close as possible to the chip.
ADC clock
Sampling (n cycles)
Conversion (12 cycles)
Iref+
300µA
700µA
MS36686V1
Table 56. Maximum source impedance RAIN max(1)
Ts
(µs)
RAIN max (kΩ)
Ts (cycles)
fADC=16 MHz(2)
Multiplexed channels
Direct channels
2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V
0.25
Not allowed
Not allowed
0.7
Not allowed
4
0.5625
0.8
Not allowed
2.0
1.0
9
1
2.0
0.8
4.0
3.0
16
1.5
3.0
1.8
6.0
4.5
24
3
6.8
4.0
15.0
10.0
48
6
15.0
10.0
30.0
20.0
96
12
32.0
25.0
50.0
40.0
192
24
50.0
50.0
50.0
50.0
384
1. Guaranteed by design.
2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced
with respect to the minimum sampling time Ts (µs),



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