STLC4550

Package Information

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Package Information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

LFBGA240 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.4

0.055

A1

0.15

0.006

A2

1.065

0.042

A3

0.28

0.011

A4

0.8

0.031

b

0.25

0.3

0.35

0.010

0.012

0.014

D

8.35

8.5

8.65

0.329

0.335

0.341

D1

7.5

0.295

E

7.85

8

8.15

0.309

0.315

0.321

E1

7

0.276

e

0.5

0.020

F

0.5

0.020

ddd

0.08

0.003

eee

0.15

0.006

fff

0.05

0.002

LFBGA240

Low Profile Ball Grid Array

Body: 8.5 x 8 x 1.4mm

7870466 A