ADP1850ACPZ-R7 datasheet(5/32 Pages) AD

5 / 32 page

Data Sheet

ADP1850

Rev. C | Page 5 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN1/EN2, RAMP1/RAMP2

21 V

FB1/FB2, COMP1/COMP2, SS1/SS2, TRK1/TRK2,

FREQ, SYNC, VCCO, VDL, PGOOD1/PGOOD2

−0.3 V to +6 V

ILIM1/ILIM2, SW1/SW2 to PGND1/PGND2

−0.3 V to +21 V

BST1/BST2, DH1/DH2 to PGND1/PGND2

−0.3 V to +28 V

DL1/DL2 to PGND1/PGND2

−0.3V to VCCO + 0.3 V

BST1/BST2 to SW1/SW2

−0.3 V to +6 V

BST1/BST2 to PGND1/PGND2

20 ns Transients

32 V

SW1/SW2 to PGND1/PGND2

20 ns Transients

25 V

DL1/DL2, SW1/SW2, ILIM1/ILIM2 to

PGND1/PGND2

20 ns Negative Transients

−8 V

PGND1/PGND2 to AGND

−0.3 V to +0.3 V

PGND1/PGND2 to AGND 20 ns Transients

−8 V to +4 V

θJA on Multilayer PCB (Natural Convection)1,2

32.6°C/W

Operating Junction Temperature Range3

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Soldering Lead Temperature

260°C

1 Measured with exposed pad attached to PCB.

2 Junction-to-ambient thermal resistance (θ

JA) of the package was calculated

or simulated on multilayer PCB.

3 The junction temperature, T

J, of the device is dependent on the ambient

temperature, TA, the power dissipation of the device, PD, and the junction-to-

ambient thermal resistance of the package, θJA. Maximum junction

temperature is calculated from the ambient temperature and power

dissipation using the formula: TJ = TA + PD × θJA.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

ESD CAUTION

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