4

SMS47

2087 1.1 04/11/05

SUMMIT MICROELECTRONICS, Inc.

Preliminary Information

cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions

outside those listed in the operational sections of this specification is not

implied. Exposure to any absolute maximum rating for extended

periods may affect device performance and reliability.

Temperature Under Bias ...................... –55°C to 125°C

Storage Temperature ............................. –65°C to 150°C

Lead Solder Temperature (10s) ........................... 300 °C

Terminal Voltage with Respect to GND:

All Others ....................... –0.3V to 6.0V

Junction Temperature.......................…….....…...150°C

ESD Rating per JEDEC……………………..….…..2000V

Latch-Up testing per JEDEC………..…….......…±100mA

DC OPERATING CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS*

RECOMMENDED OPERATING CONDITIONS

(Over Recommended Operating Conditions; Voltages are relative to GND)

Industrial Temperature Range............... –40ºC to +85ºC.

Commercial Temperature Range..............–5ºC to +70ºC.

Package Thermal Resistance (

θJA)

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RELIABILITY CHARACTERISTICS

Data Retention………………….…………..…..100 Years

Endurance……………………….…..…….100,000 Cycles

Note 1: Low Range Hysteresis = 4.2 X (Vtrip - 0.5 volts) mV. For Vtrip = 1.0 volts, Hysteresis = 2.1 mV (0.21 %),

High Range Hysteresis = 12.6 X (Vtrip -0.5 volts) mV. For Vtrip = 5.0 volts, Hysteresis = 56.7 mV (1.13%).