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IRF830AS Arkusz danych(PDF) 8 Page - Vishay Siliconix |
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IRF830AS Arkusz danych(HTML) 8 Page - Vishay Siliconix |
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8 / 10 page ![]() Document Number: 91367 www.vishay.com Revision: 27-Oct-08 1 Package Information Vishay Siliconix I2PAK (TO-262) (HIGH VOLTAGE) Notes 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outmost extremes of the plastic body. 3. Thermal pad contour optional within dimension E, L1, D1, and E1. 4. Dimension b1 and c1 apply to base metal only. A E B A A A c2 c A1 Base metal Plating b1, b3 (b, b2) c1 c Section A - A Section B - B and C - C Scale: None E1 E Seating plane Lead tip (Datum A) L1 L2 B B C C L D 2 x e 3 x b2 3 x b 0.010 A B M M D1 MILLIMETERS INCHES MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX. A 4.06 4.83 0.160 0.190 D 8.38 9.65 0.330 0.380 A1 2.03 3.02 0.080 0.119 D1 6.86 - 0.270 - b 0.51 0.99 0.020 0.039 E 9.65 10.67 0.380 0.420 b1 0.51 0.89 0.020 0.035 E1 6.22 - 0.245 - b2 1.14 1.78 0.045 0.070 e 2.54 BSC 0.100 BSC b3 1.14 1.73 0.045 0.068 L 13.46 14.10 0.530 0.555 c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.065 c1 0.38 0.58 0.015 0.023 L2 3.56 3.71 0.140 0.146 c2 1.14 1.65 0.045 0.065 ECN: S-82442-Rev. A, 27-Oct-08 DWG: 5977 |
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