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REF7012QFKHT Arkusz danych(PDF) 22 Page - Texas Instruments |
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REF7012QFKHT Arkusz danych(HTML) 22 Page - Texas Instruments |
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22 / 40 page ![]() J A D JA T T P R T u (3) where • PD is the device power dissipation • TJ is the device junction temperature • TA is the ambient temperature • RθJA is the package (junction-to-air) thermal resistance Because of this relationship, acceptable load current in high temperature conditions may be less than the maximum current-sourcing capability of the device. In no case should the device be operated outside of its maximum power rating because doing so can result in premature failure or permanent damage to the device. REF70 SNAS781E – OCTOBER 2020 – REVISED JULY 2022 www.ti.com 22 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: REF70 |
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