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AT24C01C Arkusz danych(PDF) 36 Page - Microchip Technology |
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AT24C01C Arkusz danych(HTML) 36 Page - Microchip Technology |
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36 / 45 page ![]() REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2017 Microchip Technology Inc. Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A3 e L E N 0.50 BSC 0.152 REF 1.20 0.35 0.18 0.50 0.00 0.25 0.40 1.30 0.55 0.02 3.00 BSC MILLIMETERS MIN NOM 8 1.40 0.45 0.30 0.60 0.05 MAX K- 0.20 - Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 1.40 2.00 BSC 1.50 1.60 Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package AT24C01C/AT24C02C Packaging Information © 2018 Microchip Technology Inc. Datasheet DS20006111A-page 36 |
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