STGAP2SCMTR datasheet(4/23 Pages) STMICROELECTRONICS

4 / 23 page

Electrical data

3.1

Absolute maximum ratings

Table 2. Absolute maximum ratings

Symbol

Parameter

Test condition

Min.

Max.

Uni

VDD

Logic supply voltage vs. GND

-0.3

6.5

VLOGIC

Logic pins voltage vs. GND

-0.3

6.5

Positive supply voltage (VH vs. GNDISO)

-0.3

VOUT

Voltage ongate driver outputs (GON, GOFF, CLAMP vs. GNDISO)

- 0.3

VH +0.3

VISO-OP Input to output isolation voltage (GND vs. GNDISO)

DC or peak

-1700

+1700

Junction temperature

-40

150

°C

Storage temperature

-50

150

°C

PDin

Power dissipation input chip

TA = 25 °C

PDout

Power dissipation output chip

TA = 25 °C

850

ESD

HBM (human body model)

3.2

Thermal data

Table 3. Thermal data

Symbol

Parameter

Package

Value

Unit

Rth(JA)

Thermal resistance junction to ambient

SO-8

123

°C/W

3.3

Recommended operating conditions

Table 4. Recommended operating conditions

Symbol

Parameter

Test conditions

Min.

Max.

Unit

VDD

Logic supply voltage vs. GND

3.1

5.5

VLOGIC

Logic pins voltage vs. GND

5.5

Positive supply voltage (VH vs. GNDISO)

9.6

FSW

Maximum switching frequency(1)

MHz

tOUT

Output pulse width (GOUT, GON-GOFF)

100

Operating junction temperature

-40

125

°C

1. Actual limit depends on power dissipation and TJ.

STGAP2S

Electrical data

DS12541 - Rev 3

page 4/23

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