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TLP627MF Arkusz danych(PDF) 2 Page - Toshiba Semiconductor |
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TLP627MF Arkusz danych(HTML) 2 Page - Toshiba Semiconductor |
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2 / 18 page ![]() TLP627M,TLP627MF 2 4. 4. 4. 4. Packaging (Note) Packaging (Note) Packaging (Note) Packaging (Note) TLP627M 11-5B2S TLP627M(LF1,TP1) 11-5B201S TLP627M(LF5,TP5) 11-5B205S TLP627MF 11-5B202S TLP627MF(LF4,TP4) 11-5B204S Note: Through-hole type: TLP627M, TLP627MF Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 5. 5. 5. 5. Pin Assignment Pin Assignment Pin Assignment Pin Assignment 1: Anode 2: Cathode 3: Emitter 4: Collector 6. 6. 6. 6. Mechanical Parameters Mechanical Parameters Mechanical Parameters Mechanical Parameters Characteristics Creepage distances Clearance Internal isolation thickness 7.62 mm pitch TLP627M type (Min) 7.0 7.0 0.4 10.16 mm pitch TLP627MF type (Min) 8.0 8.0 0.4 Unit mm 2018-12-06 Rev.1.0 ©2018 Toshiba Electronic Devices & Storage Corporation |
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