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ALED6000 Arkusz danych(PDF) 39 Page - STMicroelectronics |
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ALED6000 Arkusz danych(HTML) 39 Page - STMicroelectronics |
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39 / 45 page ![]() Symbol mm Min. Typ. Max. L1 1.00 k 0 8 aaa 0.10 Note: HTSSOP stands for thermally enhanced variations. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. The size of exposed pad is variable depending of lead frame design pad size. End user should verify “D1” and “E2” dimensions for each device application. Figure 36. HTSSOP16 recommended footprint ALED6000 HTSSOP16 package information DS13018 - Rev 4 page 39/45 |
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