Symbol

Parameter

Min Typ

Max

Unit

NC

-

-

-

-

-

SF7

Squib/LEA high-side channel 7

-1(1)

-

40

V

SS67

Squib/LEA high-side supply channel 6 and 7

-0.3

-

40

V

SR7

Squib/LEA low-side channel 7

-0.3

-

35

V

SG67

Squib/LEA low-side ground channel 6 and 7

-0.3

-

0.3

V

SR6

Squib/LEA low-side channel 6

-0.3

-

35

V

SF6

Squib/LEA high-side channel 6

-1(1)

-

40

V

SF5

Squib high-side channel 5

-1(1)

-

40

V

SS45

Squib high-side supply channel 4 and 5

-0.3

-

40

V

NC

-

-

-

-

-

SR5

Squib low-side channel 5

-0.3

-

35

V

SG45

Squib low-side ground channel 4 and 5

-0.3

-

0.3

V

SR4

Squib low-side channel 4

-0.3

-

35

V

NC

-

-

-

-

-

SF4

Squib high-side channel 4

-1(1)

-

40

V

RESET_N

Reset input

-0.3

-

min (VCC+0.3, 4.6)

V

SPI_MISO_RS

Remote sensor SPI data out

-0.3

-

min (VCC+0.3, 4.6)

V

SPI_MOSI_RS

Remote sensor SPI data in

-0.3

-

min (VCC+0.3, 4.6)

V

SPI_SCLK_RS

Remote sensor SPI clock

-0.3

-

min (VCC+0.3, 4.6)

V

SPI_CS_RS

Remote sensor SPI chip select

-0.3

-

min (VCC+0.3, 4.6)

V

VCC

VCC supply input voltage

-0.3

-

4.6

V

NC

-

INT_REG_SUP

Internal regulator supply voltage pin

-0.3

-

40

V

AGND

Analog ground

-0.3

-

0.3

V

SPI_MISO_G

Global SPI data out

-0.3

-

min (VCC+0.3, 4.6)

V

SPI_MOSI_G

Global SPI data in

-0.3

-

min (VCC+0.3, 4.6)

V

SPI_SCLK_G

Global SPI clock

-0.3

-

min (VCC+0.3, 4.6)

V

SPI_CS_G

Global SPI chip select

-0.3

-

min (VCC+0.3, 4.6)

V

CLKIN

External clock input

-0.3

-

min (VCC+0.3, 4.6)

V

ARM_CS_RS

Arm status capture input (on remote sensor SPI)

-0.3

-

min (VCC+0.3, 4.6)

V

SUBGND1

Substrate ground 1 (fused with lead frame)

-0.3

-

0.3

V

Ex Pad Down

Substrate ground (backside)

-0.3

-

0.3

V

1. In the case of deployment turn off the transient voltages on SS and SF pins can move away from each other until a

maximum voltage of SS-SF < 45 V for a limited transient time (6.5 μs maximum) with no damage on device. Additionally in

this time transient, in worst case load condition (maximum load inductance 56 μH) the peak energy that can be handled by

the ESD protection on SF pin is 128 μJ within a maximum time of 6.5 μs.

2. Valid in transient conditions only.

Table 3. ESD protection

Symbol

Parameter

Min

Typ

Max

Unit

All pins

HBM

-2

-

2

kV

All pins

CDM (values for corner pins in brackets)

-500/(-750)

-

500/(750)

V

L9689E

Absolute maximum ratings

DB4807 - Rev 2

page 7/19