L99H02 datasheet(42/51 Pages) STMICROELECTRONICS

Numer części	L99H02

Szczegółowy opis	H-bridge gate driver for automotive applications

PDF	51 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

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42 / 51 page

Package and packing information

L99H02

42/51

DS12547 Rev 6

Package and packing information

5.1

ECOPACK

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

5.2

Package thermal data

Figure 12. PowerSSO-36 Rthj-amb vs. PCB copper area in open box free air condition

Note:

In Figure 12 the Layout condition of Rth and Zth measurements (PCB: double layer, thermal

vias FR4 area = 129 mm x 60 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and

back side). Copper areas: from minimum pad layout to 8 cm2).

024

RTHj_amb(°C/W)

PCB Cu heatsink area (cm^2)

L99H02 Arkusz danych(PDF) 42 Page - STMicroelectronics