STA8100GA datasheet(36/42 Pages) STMICROELECTRONICS

36 / 42 page

Package information

STA8100GA

36/42

DS13006 Rev 4

Table 35. LFBGA81 package mechanical data

Ref

Dimensions (mm)

Min.

Typ.

Max.

A(1)

1. LFBGA stands for Thin profile Fine Pitch Ball Grid Array:

Thin profile: 1.2 mm < A Max

≤ 1.7 mm / Fine pitch: e < 1.00 mm.

The total profile height (Dim A) is measured from the seating plane “C” to the top of the component.

The maximum total package height is calculated by the RSS (Root Sum Square) methodology:

A Max = A1 Typ + A3 Typ + A4 Typ +

√ (A12 + A32 + A42 tolerance values).

—

1.70

0.25

—

0.86

—

0.27

—

0.62

b(2)

2. The typical ball diameter before mounting is 0.40 mm.

0.35

0.40

0.45

7.85

8.00

8.15

—

6.40

—

7.85

8.00

8.15

—

6.40

—

0.80

—

0.80

—

ddd

—

0.10

eee(3)

3. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball

must lie within this tolerance zone.

—

0.15

fff(4)

4. The tolerance of position that controls the location of the balls within the matrix with respect to each other.

For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position

as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each

tolerance zone fff in the array is contained entirely in the respective zone eee above. The axis of each ball

must lie simultaneously in both tolerance zones.

—

0.08

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