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STGAP2SICSCTR Arkusz danych(PDF) 15 Page - STMicroelectronics |
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STGAP2SICSCTR Arkusz danych(HTML) 15 Page - STMicroelectronics |
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15 / 22 page ![]() 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10.1 SO-8W package information Table 10. SO-8W package dimensions Symbol Dimensions (mm) Min. Typ. Max A 2.34 2.64 A1 0.1 0.3 b 0.3 0.51 c 0.2 0.33 D(1) 5.64 6.05 e 1.27 BSC E1 7.39 7.59 E 10.11 10.52 L 0.61 0.91 h 0.25 0.76 Ɵ 0° 8° aaa 0.25 bbb 0.25 ccc 0.1 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. STGAP2SICS Package information DS13402 - Rev 4 page 15/22 |
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