Features

Automotive compliancy

•

AEC-Q100 grade 2 ongoing

•

Operating junction temperature: -40°C to 125°C

•

ISO26262 compliant to support ASIL B system integration

•

Cyber security features

Hybrid 5.1 MP global and rolling shutter features

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3D stacked sensor 40 nm/65 nm

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5.1 MP sensor (2560 x 1984)

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2.25 µm x 2.25 µm BSI (backside illuminated) pixel

•

RGB/NIR pixel technology with RGB NIR 4x4 pattern

•

Image array size: 5.8 mm x 4.5 mm

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Optical format 1/2.5 inch

•

Bare die or OBGA package

Innovative features

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Dual exposure controls (RGB and IR)

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On-chip bayerization ISP (image signal processor)

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On-chip color HDR (high dynamic range) merges

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On-chip NIR smart upscale

•

4 programmable contexts, in a versatile sequence, with up to 32 elements

Interface

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Quad lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane (MIPI CSI-2

copyright© 2005-2010 MIPI alliance, inc. standard for camera serial interface

2 (CSI-2) version 1.0)

•

6 programmable GPIOs (general-purpose input/outputs) to control the LED

(light-emitting diode)

–

Output synchronized with sensor integration periods

–

PWM (pulse-width modulation) control

•

Fast mode plus I²C control interface

Unique imaging performance

•

Peak quantum efficiency 25% @ 940 nm

•

HDR linear dynamic range up to 100 dB in rolling shutter mode

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Up to 60 frames per second at full resolution

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Ultralow noise

Root part number

Description

VB1940

OBGA package

VD1940

Bare die

Automotive grade 5.1 megapixel backside illuminated global and rolling shutter

sensor for near infrared and visible scenes

VB1940, VD1940

Data brief

DB4790 - Rev 1 - July 2022

For further information contact your local STMicroelectronics sales office.

www.st.com