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STF35N65DM2 Arkusz danych(PDF) 5 Page - STMicroelectronics |
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STF35N65DM2 Arkusz danych(HTML) 5 Page - STMicroelectronics |
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5 / 13 page ![]() STF35N65DM2 Electrical characteristics DocID030873 Rev 2 5/13 Table 8: Source-drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current - 32 A ISDM(1) Source-drain current (pulsed) - 90 A VSD(2) Forward on voltage VGS = 0 V, ISD = 32 A - 1.6 V trr Reverse recovery time ISD = 32 A, di/dt = 100 A/µs, VDD = 60 V (see Figure 16: "Test circuit for inductive load switching and diode recovery times") - 100 ns Qrr Reverse recovery charge - 0.42 µC IRRM Reverse recovery current - 8.4 A trr Reverse recovery time ISD = 32 A, di/dt = 100 A/µs, VDD = 60 V, Tj = 150 °C (see Figure 16: "Test circuit for inductive load switching and diode recovery times") - 205 ns Qrr Reverse recovery charge - 1.8 µC IRRM Reverse recovery current - 17.6 A Notes: (1)Pulse width is limited by safe operating area. (2)Pulse test: pulse duration = 300 µs, duty cycle 1.5% |
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