1

3

2

4

5

6

Vee2

Vee3

RF

Out

Vee1

Vtune

(Maximum

100pF)

1

3

1.800

(0.071)

1.105

(0.044)

2

1.504

(0.060)

0.0

0.0

1.504

(0.060)

4

1.105

(0.044)

5

0.566

(0.022)

0.673

(0.027)

1.350

(0.053)

6

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©

2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

Page 3 of 5

Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 8OSC0464)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.507 mg.

Bond Pad #1 (Vtune)

Bond Pad #2 (Vee1)

Bond Pad #3 (RF Out)

Bond Pad #4 (Vee2)

Bond Pad #5 (Vee3)

Bond Pad #6 (Vee3)

May 2005 - Rev 05-May-05

7.4-8.6 GHz GaAs MMIC

Voltage Controlled Oscillator

8OSC0464

8OSC0464

Vtune

Vee1

RF

Out

Vee2

Vee3