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PC33975AR2 Arkusz danych(PDF) 27 Page - Freescale Semiconductor, Inc |
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PC33975AR2 Arkusz danych(HTML) 27 Page - Freescale Semiconductor, Inc |
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27 / 32 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 27 33975 PACKAGE DIMENSIONS PACKAGE DIMENSIONS The silicon device is packaged in the 32 terminal SOIC with an exposed pad. The exposed pad is thermally conductive and electrically isolated to the die. It is recommended that the exposed pad be electrically connected to ground. Important: For the most current revision of the package, visit www.freescale.com and perform a “keyword” search on the “98A” number listed below. |
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