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©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.

January 2005

Corporate Office

10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823

Global Offices

USA 510-979-8000

JAPAN 81-43-351-3320

CHINA 86-21-5976-5858

MALAYSIA 603-4257-6222

KOREA 82-31-639-8911

TAIWAN 886-3-593-6565

UK 44-1483-413-700

NETHERLANDS 31-38-333-2023

MQFP-d

Heat Spreader Metric Quad Flat Pack

SPECIFICATIONS

Die Thickness

380-560

µm (15-22mils) range preferred

Gold Wire

25/30

µm (1.0/1.2mils) diameter, 99.999% Au

Lead Finish

85/15 Sn/Pb or Matte Tin

Marking

Laser / ink

Packing Options

JEDEC tray / tape and reel

RELIABILITY

Moisture Sensitivity Level

JEDEC Level 3

Temperature Cycling

-65°C/150°C, 1000 cycles

High Temperature Storage

150°C, 500 hrs

Pressure Cooker Test

121°C 100% RH,

2 atm, 168 hrs

Liquid Thermal Shock (opt)

-55°C/125°C, 1000 cycles

CROSS-SECTION

ELECTRICAL PERFORMANCE

Package

Body Size (mm)

Pad Size (mm)

Frequency

Self Inductance (nH) Self Capacitance(pF)

100L

14 x 20 x 2.7

9.0 x 9.0

100MHz

6.3~8.7

0.56~1.11

208L

28 x 28 x 3.4

10.5 x 10.5

100MHz

11.6~14.7

1.43~1.56

Notes: *Results are simulated. Data is available through 2.5GHz.

THERMAL PERFORMANCE,

θθθθθja (°C/W)

Package

Body Size (mm)

Pad Size (mm)

Die Size (mm)

Thermal Performance,

θθθθθja (°C/W)

100L

14 x 20 x 2.7

9.0 x 9.0

7.8 x 7.8

26.6

208L

28 x 28 x 3.4

14.0 x 14.0

10.2 x 10.2

18.4

Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.

PACKAGE CONFIGURATIONS

Package Size (mm)

Lead Count

14 x 14 x 2.0

64, 80

14 x 14 x 2.7

64, 80

14 x 20 x 2.7

80, 100, 128

28 x 28 x 3.4

120, 128, 144, 160, 208

32 x 32 x 3.4

240