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STNRGPF02 Arkusz danych(PDF) 34 Page - STMicroelectronics |
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STNRGPF02 Arkusz danych(HTML) 34 Page - STMicroelectronics |
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34 / 43 page ![]() 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 TSSOP38 package information Figure 32. TSSOP38 package outline 0117861_C Table 18. TSSOP38 package mechanical data (“TSSOP” stands for “Thin Shrink Small Outline Package”) Symbol Dimensions (mm) Min. Typ. Max A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 b 0.17 - 0.27 STNRGPF02, STNRGPF12 Package information DS12895 - Rev 2 page 34/43 |
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