NCC5003JBGL datasheet(1/1 Pages) CALMIRCO

Numer części	NCC5003JBGL

Szczegółowy opis	BUSSED RESISTOR NETWORK

PDF	1 Pages

Scroll/Zoom	100%

Producent	CALMIRCO [California Micro Devices Corp]

Strona internetowa	http://www.calmicro.com

Logo

1 / 1 page

6/2/2000

215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214

Fax: (408) 263-7846

www.calmicro.com

1

CALIFORNIA MICRO DEVICES

NCC

BUSSED RESISTOR NETWORK

California Micro Devices’ resistor arrays are the hybrid

equivalent to the bussed resistor networks available in

surface-mount packages. The resistors are spaced on

ten mil centers resulting in reduced real estate. These

C0970500

STANDARD NETWORK SCHEMATIC DIAGRAM

chips are manufactured using advanced thin film

processing techniques and are 100% electrically

tested and visually inspected.

R1

R4

R2

R5

R7

R3

R6

R8

60

90

N

O

I

T

A

N

G

I

S

E

D

R

E

B

M

U

N

T

R

A

P

C

N

3

0

5F

A

G

W

P

s

e

i

r

e

Se

u

l

a

Ve

c

n

a

r

e

l

o

TR

C

Ts

d

a

P

d

n

o

Bg

n

i

k

c

a

B

o

i

t

a

R

e

c

n

a

r

e

l

o

T

e

r

a

s

t

i

g

i

d

3

t

s

r

i

F%

5

.

0

±

=

Dm

p

0

1

±

=

r

e

t

e

L

o

Nd

l

o

G

=

Gd

l

o

G

=

W%

1

=

r

e

t

e

L

o

N

.

e

u

l

a

v

t

n

a

c

i

f

i

n

g

i

s%

1

±

=

Fm

p

0

5

±

=

Am

u

n

i

m

u

l

A

=

r

e

t

e

L

o

Nd

e

p

a

L

=

L%

5

.

0

=

P

-

s

e

r

p

e

r

t

i

g

i

d

t

s

a

L%

2

±

=

Gm

p

5

2

±

=

Br

e

h

ti

E

=

r

e

t

e

L

o

N

f

o

r

e

b

m

u

n

s

t

n

e

s%

5

±

=

J

s

e

t

a

c

i

d

n

i

R

.

s

o

r

e

z%

0

1

±

=

K

.

t

n

i

o

p

l

a

m

i

c

e

d%

0

2

±

=

M

S

N

O

I

T

A

C

I

F

I

C

E

P

S

L

A

C

I

R

T

C

E

L

E

r

e

t

e

m

a

r

a

P

s

n

o

i

t

i

d

n

o

C

t

s

e

T

R

C

TC

°

5

2

1

o

t

C

°

5

–C

/

m

p

0

1

±x

a

M

e

g

a

t

l

o

V

g

n

i

t

a

r

e

p

OC

°

5

2

1

o

t

C

°

5

–c

d

V

0

5x

a

M

)

r

o

t

s

i

s

e

r

e

p

(

g

n

i

t

a

R

r

e

w

o

P

)

C

°

0

5

1

@

0

o

t

y

l

r

a

e

n

il

e

t

a

r

e

D

(

C

°

0

7

@w

m

0

5x

a

M

k

c

o

h

S

l

a

m

r

e

h

TF

2

0

2

-

D

T

S

-

L

I

M

7

0

1

d

o

h

t

e

M@

%

5

2

.

0

±

∆Rx

a

M

e

r

u

s

o

p

x

E

e

r

u

t

a

r

e

p

m

e

T

h

g

i

Ht

n

e

i

b

m

A

C

°

0

5

1

@

s

r

H

0

1%

5

2

.

0

±

∆Rx

a

M

e

r

u

t

s

i

o

MF

2

0

2

-

D

T

S

-

L

I

M

6

0

1

d

o

h

t

e

M%

5

.

0

±

∆Rx

a

M

e

f

i

L

)

r

h

0

1

/

C

°

5

2

1

(

F

2

0

2

-

D

T

S

-

L

I

M

8

0

1

d

o

h

t

e

M%

5

.

0

±

∆Rx

a

M

e

s

i

o

NF

2

0

2

-

D

T

S

-

L

I

M

8

0

3

d

o

h

t

e

MB

d

5

3

–x

a

M

≥

k

0

5

2

Ω

B

d

0

3

–x

a

M

d

a

o

l

r

e

v

O

e

m

i

T

t

r

o

h

S1

0

4

3

8

-

R

-

L

I

M%

5

2

.

0x

a

M

e

c

n

a

t

s

i

s

e

R

n

o

i

t

a

l

u

s

n

IC

°

5

2

@0

1

x

1

2

1 Ω

.

n

i

M

S

N

O

I

T

A

C

I

F

I

C

E

P

S

L

A

C

I

N

A

H

C

E

M

e

t

a

r

t

s

b

u

Sk

c

i

h

t

s

li

m

2

±

0

1

n

o

c

il

i

S

r

e

y

a

L

n

o

i

t

a

l

o

s

In

i

m

,

k

c

i

h

t

Å

0

,

0

1

2

0

i

S

g

n

i

k

c

a

B)

l

a

n

o

i

t

p

o

d

l

o

g

(

d

e

p

a

L

n

o

i

t

a

z

il

a

t

e

Mn

i

m

,

k

c

i

h

t

Å

0

,

0

1

m

u

n

i

m

u

l

A

)

l

a

n

o

i

t

p

o

d

l

o

g

Å

0

,

5

1

(

n

o

i

t

a

v

i

s

a

Pe

d

i

r

t

i

N

n

o

c

il

i

S

E

U

L

A

V

0

1

m

o

r

f

s

r

o

t

s

i

s

e

r

8

Ω

K

0

5

o

t

Ω

G

N

I

G

A

K

C

A

P

.

d

r

a

d

n

a

t

s

i

m

u

m

i

x

a

m

s

p

i

h

c

6

9

1

f

o

s

y

a

r

t

e

r

a

u

q

s

h

c

n

i

o

w

T

S

E

T

O

N

.

r

e

h

t

o

n

a

o

t

e

u

l

a

v

e

n

o

m

o

r

f

y

r

a

v

y

a

m

n

r

e

t

a

p

r

o

t

s

i

s

e

R

.

1

Formats

Die Size: 90±3 x 60±3 mils

Bonding Pads: 5x7 mils typical

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