BCR

www.vishay.com

Vishay Electro-Films

Revision: 26-Oct-2020

1

Document Number: 61023

For technical questions, contact: efi@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Thin Film, Back-Contact Resistor

Product may not be to scale

LINKS TO ADDITIONAL RESOURCES

The Back Contact Resistor (BCR) series single-value

back-contact resistor chip is one of the smallest chips

available.



The BCR requires only one wire bond thus saving hybrid

space.



The BCRs are manufactured using Vishay Electro-Films

(EFI) sophisticated thin film equipment and manufacturing

technology. The BCRs are 100 % electrically tested and

visually inspected to MIL-STD-883, method 2032 class H

or K.

FEATURES

• Wire bondable

• Only one wire bond required

• Small size: 0.020 inches square

• Resistance range: 10

 to 1 M

• Oxidized silicon substrate for good power

dissipation

• Moisture resistant

• Case size: 0202

• Resistor material: tantalum nitride, self-passivating

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

Vishay EFI BCR resistor chips are widely used in hybrid

packages where space is limited. The bottom connection is

made by attaching the back of the chip to the substrate

either eutectic or with conductive epoxy. The single wire

bond is made to the notched pad on the top of the chip. (The

other rectangular pad on the top of the chip is a via hole, a

low-ohmic contact connecting the resistor to the bottom of

the chip.)

333

DDD3 D

3D Models

TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES

PARAMETER

VALUE

UNIT

Total resistance range

10 to 1M



Standard tolerances

± 0.1, ± 0.2, ± 0.5, ± 1, ± 2, ± 5

%

TCR

± 25, ± 50, ± 100, ± 250

ppm/°C

STANDARD ELECTRICAL SPECIFICATIONS

PARAMETER

VALUE

UNIT

Noise, MIL-STD-202, method 308



100

 to 250 k

< 100

 or > 251 k

-35 typ.

-20 typ.

dB

Moisture resistance, MIL-STD-202, method 106

± 0.5 max.

R/R

%

Stability, 1000 h, +125 °C, 125 mW

± 1.0 max.

R/R

%

Operating temperature range

-55 to +125

°C

Thermal shock, MIL-STD-202, method 107, test condition F

± 0.25 max.

R/R

%

High temperature exposure, +150 °C, 100 h

± 0.5 max.

R/R

%

Dielectric voltage breakdown

200

V

Insulation resistance

1012 min.



Operating voltage

75 max.

V

DC power rating at +70 °C (derated to zero at +175 °C)

0.250

W

5 x rated power short-time overload, +25 °C, 5 s

± 0.25 max.

R/R

%

0.1 %

Tightest Standard Tolerance Available

± 250 ppm/°C

± 50 ppm/°C

± 100 ppm/°C

0.2 %

1 M

Ω

100

Ω

10

Ω

200 k

Ω

± 25 ppm/°C

20

Ω 50 Ω

200

Ω 1 kΩ

360 k

Ω

620 k

Ω

0.5 %

1 %

2 %

5 %