MCP6L71RT-ESLASHMS datasheet(4/40 Pages) MICROCHIP

4 / 40 page

MCP6L71/1R/2/4

DS20002145B-page 4

 2009-2019 Microchip Technology Inc.

TABLE 1-2:

AC ELECTRICAL SPECIFICATIONS

TABLE 1-3:

TEMPERATURE SPECIFICATIONS

Power Supply

Supply Voltage

VDD

2.0

—

6.0

Quiescent Current per Amplifier

150

240

µA

IO = 0

Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND,

VCM =VDD/2, VOUT  VDD/2, VL = VDD/2, RL =10 kto VL and CL = 60 pF. (Refer to Figure 1-1.)

Parameters

Sym

Min

Typ

Max

Units

Conditions

AC Response

Gain Bandwidth Product

GBWP

—

2.0

—

MHz

Phase Margin

—

G = +1 V/V

Slew Rate

—

0.9

—

V/µs

Noise

Input Noise Voltage

Eni

—

4.6

—

µVP-P

f = 0.1 Hz to 10 Hz

Input Noise Voltage Density

eni

—

nV/

Hz f = 10 kHz

Input Noise Current Density

ini

—

3—

fA/

Hz

f = 1 kHz

TABLE 1-1:

DC ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = 5.0V, VSS =GND, VCM =VDD/2,

VOUT  VDD/2, VL = VDD/2 and RL =10kto VL. (Refer to Figure 1-1.)

Parameters

Sym

Min(1)

Typ

Max(1)

Units

Conditions

Note 1:

For design guidance only; not tested.

Electrical Characteristics: Unless otherwise indicated, VDD = +2.0V to +5.5V and VSS = GND.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

—

+125

°C

Operating Temperature Range

-40

—

+125

°C

Note 1

Storage Temperature Range

-65

—

+150

°C

Thermal Package Resistances

Thermal Resistance, 5-Lead SOT-23

JA

—

256

—

°C/W

Thermal Resistance, 8-Lead SOIC

JA

—

163

—

°C/W

Thermal Resistance, 8-Lead MSOP

JA

—

206

—

°C/W

Thermal Resistance, 14-Lead SOIC

JA

—

120

—

°C/W

Thermal Resistance, 14-Lead TSSOP

JA

—

100

—

°C/W

Note 1:

The Junction Temperature (TJ) must not exceed the absolute maximum specification of +150°C.

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