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TSV772 Arkusz danych(PDF) 24 Page - STMicroelectronics |
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TSV772 Arkusz danych(HTML) 24 Page - STMicroelectronics |
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24 / 32 page ![]() 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 DFN8 2x2 package information Figure 46. DFN8 2x2 package outline Table 7. DFN8 2x2 package mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.51 0.55 0.60 0.020 0.022 0.024 A1 0.05 0.002 A3 0.15 0.006 b 0.18 0.25 0.30 0.007 0.010 0.012 D 1.85 2.00 2.15 0.073 0.079 0.085 D2 1.45 1.60 1.70 0.057 0.063 0.067 E 1.85 2.00 2.15 0.073 0.079 0.085 E2 0.75 0.90 1.00 0.030 0.035 0.039 e 0.50 0.020 L 0.225 0.325 0.425 0.009 0.013 0.017 ddd 0.08 0.003 TSV782 Package information DS14011 - Rev 3 page 24/32 |
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