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Z00607MN Arkusz danych(PDF) 6 Page - STMicroelectronics |
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Z00607MN Arkusz danych(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() Packaging information Z00607 6/8 DocID6629 Rev 9 3 Packaging information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. Footprint (dimensions in mm) Table 5. SOT-223 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 1.80 0.071 A1 0.02 0.10 0.001 0.004 B 0.60 0.70 0.85 0.024 0.027 0.033 B1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 D(1) 1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches) 6.30 6.50 6.70 0.248 0.256 0.264 e2.3 0.090 e1 4.6 0.181 E(1) 3.30 3.50 3.70 0.130 0.138 0.146 H 6.70 7.00 7.30 0.264 0.276 0.287 V10° max A A1 e1 D B1 H E e 12 4 3 B V c 3.25 1.32 7.80 5.16 1.32 2.30 0.95 |
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