| Zakładka z wyszukiwarką danych komponentów |
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ST33TPM12LPC Arkusz danych(PDF) 11 Page - STMicroelectronics |
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ST33TPM12LPC Arkusz danych(HTML) 11 Page - STMicroelectronics |
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11 / 13 page ![]() DocID022203 Rev 4 11/13 ST33TPM12LPC Delivery packing Figure 7. Embossed carrier tape for VFQFPN 5x5 mm 1. Drawing is not to scale. Figure 8. Embossed carrier tape for TSSOP 16 mm 1. Drawing is not to scale. Table 6. Carrier tape dimensions for VFQFPN 5x5 mm Package A0 B0 K0 D1 Min. P P2 D P0 E F W T Max. Unit FPN 5x5 5.25 ±0.1 5.25 ±0.1 1.1 ±0.1 1.5 8 ±0.1 2 ±0.1 1.55 ±0.05 4 ±0.1 1.75 ±0.1 5.5 ±0.1 12 ±0.3 0.3 ±0.05 mm Table 7. Carrier tape constant dimensions for TSSOP 16 mm tape Tape size Ao, Bo, Ko(1) D E Po T Max. Unit 16 mm See note. 1.5 +0.1 / -0 1.75 ±0.1 4 ±0.1 0.4 mm 1. Ao, Bo, Ko, are determined by components sizes. The clearance between the component and the cavity must be within 0.05 mm (Min.) to 0.90 mm (Max.) |
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