LP3905 datasheet(6/15 Pages) NSC

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General Electrical Characteristics (Notes 2, 8, 9) (Continued)

LDO Regulator Electrical Characteristics (Continued)

The linear regulators have a current rating of I

max= 150mA with COUT = 1.0µF. A 100mA rating applies with COUT = 0.47µF.

Unless otherwise specified, limits are set with V

IN = 3.8V, VEN1/2 = 3.8V, CIN = 1µF, COUT = 0.47µF, IOUT = 1.0mA. Limits in

standard typeface are for T

J = 25˚C. Limits in boldface type apply over the full junction temperature range (−40˚C

≤ T

≤

+125˚C). Unless otherwise noted, specifications apply to the LP3905 Typical Application Circuit (Figure. 1)(Notes 2, 8)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Transient Characteristics (Note 15)

∆V

OUT

Line Transient (Note 15)

IN =(VOUT(NOM) + 1.0V) to

OUT(NOM) + 1.6V) in 10µs, IOUT =1

IN =(VOUT(NOM) + 1.6V) to

OUT(NOM) + 1.0V) in 10µs, IOUT =

1mA

Load Transient (Note 15)

OUT = 1mA to 100mA in 10µs

-70

OUT = 100mA to 1mA in 10µs

OUT = 1mA to 150mA in 10µs

OUT = 1.0µF

-100

OUT = 150mA to 1mA in 10µs

OUT = 1.0µF

Overshoot on Startup

(Note 15)

Electrical Characteristics Notes

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the

Electrical Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: Internal thermal shutdown circuitry protects the device from permanent damage.

Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. MIL-STD-883 3015.7

Note 5: In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated.

Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the maximum power dissipation of the device in

the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation:TA-MAX=TJ-MAX−

(

θJAxPD-MAX).

Note 6: Junction to ambient thermal resistance is highly dependent on board layout, PCB material environmental conditions and applications. In applications where

high power dissipation exists, special care must be given to thermal dissipation issues in board design. The use of thermal vias under the pad may be required. For

more on these topics, please refer to the Application Note: AN-1187: Leadless leadframe Package (LLP).

Note 7: VIN1 and VIN2 should be tied together at all times for proper Power Up

Note 8: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 9: The parameters in the electrical characteristic table are tested at VIN= 3.8V unless otherwise specified. For performance over the input voltage range refer

to datasheet curves.

Note 10: CIN,COUT: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.

Note 11: The device maintains a stable, regulated output voltage without a load.

Note 12: Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its nominal value.

Note 13: Short Circuit Current is measured with VOUT pulled to 0v and VIN worst case = 5,5V.

Note 14: There isa1M

Ω resistor between EN1,EN2 and ground on the device.

Note 15: This specification is guaranteed by design.

Note 16: For the adjustable version, feedback resistor values should be chosen for the divider network to ensure that at the desired output voltage the feedback

pin is at 0.5V. See Buck Converter Applications Information.

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