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TLVM13610RDFR Arkusz danych(PDF) 3 Page - Texas Instruments

Numer części TLVM13610RDFR
Szczegółowy opis  TLVM13610 High-Density, 3-V to 36-V Input, 1-V to 10-V Output, 8-A (10-A Peak) Synchronous Buck DC/DC Power Module with Enhanced HotRod™ QFN Package
PDF  35 Pages
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

TLVM13610RDFR Arkusz danych(HTML) 3 Page - Texas Instruments

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5 Device Comparison Table
DEVICE
ORDERABLE PART
NUMBER
RATED OUTPUT
CURRENT
PEAK OUTPUT
CURRENT
(TRANSIENT
CONDITIONS)
JUNCTION TEMPERATURE RANGE
TLVM13610
TLVM13610RDFR
8 A
10 A
–40°C to 125°C
6 Pin Configuration and Functions
1
2
18
10
9
3
4
5
6
7
8
17
16
15
14
13
12
11
19
20
21
22
VIN
EN
NC
AGND
AGND
PG
RT
AGND
VOUT
AGND
AGND
PGND
PGND
RBOOT
CBOOT
VIN
SW
VLDOIN
VCC
AGND
FB
VOUT
Figure 6-1. 22-Pin B3QFN RDF Package (Top View)
Table 6-1. Pin Functions
PIN
TYPE(1)
DESCRIPTION
NO.
NAME
1, 18
VIN1, VIN2
P
Input supply voltage. Connect the input supply to these pins. Connect input capacitors between these
pins and PGND in close proximity to the device.
2
RBOOT
I
External bootstrap resistor connection. RBOOT is brought out to use in conjunction with CBOOT to
effectively lower the value of the internal series bootstrap resistance to adjust the switch-node slew rate,
if necessary. A resistance from 0 to 500 Ω can be connected between RBOOT and CBOOT. A resistance
of 0 Ω has the fastest slew rate and highest efficiency. A value of 100 Ω creates a nice balance between
efficiency and EMI. Leaving open sets the slew rate to 20 ns and TI does not recommend due to
increased self heating.
3
CBOOT
O
Bootstrap pin for the internal high-side gate driver. A 100-nF bootstrap capacitor is internally connected
from this pin to SW within the module to provide the bootstrap voltage. CBOOT is brought out to use
in conjunction with RBOOT to effectively lower the value of the internal series bootstrap resistance to
adjust the switch-node slew rate, if necessary.
4
SW
O
Switch node. Do not place any external component on this pin or connect to any signal. The amount of
copper placed on this pin must be kept to a minimum to prevent issues with noise and EMI.
5
VLDOIN
P
Input bias voltage. Input to the internal LDO that supplies the internal control circuits. Connect to an
output voltage point to improve efficiency. Connect an optional high-quality 0.1-μF to 1-μF capacitor from
this pin to ground for improved noise immunity.
6
VCC
P
Internal LDO output. Used as a supply to the internal control circuits. Do not connect to any external
loads. A 1-μF capacitor internally connects from VCC to AGND.
7, 11, 14,
15, 21,
22
AGND
G
Analog ground. Zero-voltage reference for internal references and logic. All electrical parameters are
measured with respect to these pins. These pins must be connected to PGND. See Layout Example for
a recommended layout.
www.ti.com
TLVM13610
SLVSH63 – FEBRUARY 2023
Copyright © 2023 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TLVM13610



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