MCP970X

DS20001942J-page 8

 2005-2022 Microchip Technology Inc. and its subsidiaries

Note: Unless otherwise indicated, MCP9700/9700A/9700B: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V;

GND = Ground, Cbypass = 0.1 µF.

FIGURE 2-14:

Output Voltage vs. Power

Supply.

FIGURE 2-15:

Output vs. Settling Time to

Step VDD.

FIGURE 2-16:

Thermal Response (Air-to-

Fluid Bath).

FIGURE 2-17:

Output Voltage vs. Ambient

Temperature.

FIGURE 2-18:

Output vs. Settling Time to

Ramp VDD.

FIGURE 2-19:

Output Impedance vs.

Frequency.

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

TA = +26°C

0

2

4

6

8

10

12

Time (ms)

-2.5

-1.7

-0.8

0.0

0.8

1.7

2.5

VDD_STEP = 5V

TA = 26°C

IDD

VOUT

30

55

80

105

130

-2

0

2

4

6

8

10

12

14

16

18

Time (s)

SC70-5

1 in. x 1 in. Copper Clad PCB

Leaded, without PCB

SC70-5

SOT-23-3

TO-92-3

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

Time (ms)

-42.0

-30.0

-18.0

-6.0

6.0

18.0

30.0

IDD

VOUT

VDD_RAMP = 5V/ms

TA = +26°C

1

10

100

1000

0.1

1

10

100

1000

10000 100000

Frequency (Hz)

VDD = 5.0V

IOUT = 100 µA

TA = +26°C

1k

10k

100k

100

10

1

0.