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HC705RC16GRS/D Arkusz danych(PDF) 113 Page - NXP Semiconductors |
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HC705RC16GRS/D Arkusz danych(HTML) 113 Page - NXP Semiconductors |
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113 / 120 page ![]() MC68HC705RC16 — Rev. 3.0 General Release Specification Mechanical Specifications General Release Specification — MC68HC705RC16 Section 13. Mechanical Specifications 13.1 Contents 13.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 13.3 28-Pin Plastic Dual In-Line Package (Case 710-02) . . . . . . .114 13.4 28-Pin Small Outline Integrated Circuit Package (Case 751F-04) . . . . . . . . . . . . . . . . . . . .114 13.5 44-Pin Plastic Leaded Chip Carrier Package (Case 777-02). . . . . . . . . . . . . . . . . . . . . . . . . . .115 13.2 Introduction This section describes the dimensions of the dual-in-line package (DIP), small outline integrated circuit (SOIC) MCU package, and the plastic leaded chip carrier (PLCC) package. The following figures show the latest packages at the time of this publication. To make sure that you have the latest package specifications, contact one of the following: • Local Freescale Sales Office Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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