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Z0409MB Arkusz danych(PDF) 6 Page - STMicroelectronics |
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Z0409MB Arkusz danych(HTML) 6 Page - STMicroelectronics |
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6 / 11 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPAK package information • Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 • Lead-free package leads plating Figure 13. DPAK package outline Z0409MB Package information DS14022 - Rev 1 page 6/11 |
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